Glue-Free Cardboard Packaging

Joints Connected With Holes

Schubert’s Dotlock is a technology for cardboard packaging that eliminates the need for adhesives. It uses strategically placed perforations to bond layers of cardboard, creating packaging that is glue free and can be recycled in existing paper streams. Its tamper-resistant design eliminates the need for additional sealing labels. Dotlock achieves the strength typically provided by glue through the strategic arrangement and quantity of perforations. For instance, additional holes can be placed in corners where added strength is necessary. The size of these perforations varies with the board’s thickness. Package designs are specifically tailored to ensure optimal hole distribution for durability and functionality.

Dotlock can be applied in all areas involving solid board packaging. The technology is claimed to simplify production and reduce energy requirements associated with adhesives. It is ideal for products like food trays, bakery boxes, and gable-top packaging.

Product Name: Dotlock
Manufacturer: Gerhard Schubert GmbH
Project Status: Concept // Prototype // Market Ready // Series Production Ready

Source: Gerhard Schubert GmbH
Image Source: Gerhard Schubert GmbH